MINNEAPOLIS–(Business WIRE)–Jan 29, 2021–
CyberOptics ® Company (NASDAQ: CYBE), a leading worldwide developer and maker of large-precision 3D sensing engineering solutions, will characteristic the WX3000™ metrology and inspection method with Multi-Reflection Suppression™ (MRS) sensor technology, and superior-precision sensors for semiconductor device established-up and diagnostics at the Digital SEMI Technological know-how Unites International Summit from February 15-19th.
Tim Skunes, VP of R&D at CyberOptics, will share a relevant technological presentation ‘Fast, 100% 3D Wafer Bump Metrology and Inspection to Make improvements to Yields and 3D Method Integration’ on February 16 th. State-of-the-art Packaging (AP) and wafer degree packaging (WLP) carry on to be amid the most dynamic and speedily evolving locations of semiconductor growth and manufacturing. As the procedures and features they create have become scaled-down and more complex, suppliers confront an raising need for substantial-precision inspection and measurement to detect defects and improve course of action management. This need to have is amplified by the truth that these processes use expensive identified superior die, producing the charge of failure very superior.
The NanoResolution MRS sensor integrated into CyberOptics’ WX3000™ program delivers sub-micrometer precision on characteristics as compact as 25µm. Although retaining its potential to reject spurious a number of reflections, it provides the ability to capture and assess specular reflections from shiny surfaces of solder balls, bumps and pillars, letting extremely precise inspection and 3D metrology of these vital packaging features. Complete 100% 3D/2D inspection and bump metrology can be accomplished vs. time-consuming choice methods that require individual scans for 3D and 2D, or a sampling only method. With information processing speeds in extra of 75 million 3D factors per second, it provides manufacturing-deserving throughput better than 25 wafers (300mm) per hour, at speeds 2-3X more quickly.
“Whether it’s for the back-close or mid-conclude of the semiconductor fab, our proprietary sensors and systems supply substantial benefits to prospects in phrases of enhanced yields, procedures and productiveness,” stated Dr. Subodh Kulkarni, President and CEO, CyberOptics. “Compared to other answers, our technological know-how will save our clients sizeable time and expense.”
The firm will also digitally show high-precision sensors that approach and products engineers use in the entrance-finish of the fab to pace machines qualification, shorten machines upkeep cycles, lessen gear bills and improve preventative routine maintenance plans. The WaferSense ® Auto Resistance Sensor™ (ARS) enables true-time resistance measurements of plating cell contacts in semiconductor Electrochemical Deposition (ECD) apps, and the In-Line Particle Sensor™ (IPS) detects, monitors and permits troubleshooting of particles down to .1 µm in fuel and vacuum lines in any parts of the fab 24/7.
The Technologies Unites World wide Summit brings together the world microelectronics supply chain, producers and end customers for a electronic practical experience showcasing market considered leaders and substantial-worth technological content from all-around the world. CyberOptics is a platinum sponsor.
For far more info, take a look at www.cyberoptics.com.
CyberOptics Company ( www.cyberoptics.com ) is a top world developer and company of superior-precision 3D sensing engineering alternatives. CyberOptics’ sensors are made use of for inspection and metrology in the SMT and semiconductor markets to considerably boost yields and efficiency. By leveraging its top edge technologies, the Company has strategically recognized by itself as a world leader in higher precision 3D sensors, allowing CyberOptics to additional maximize its penetration of key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide functions by its services in North The united states, Asia and Europe.
Statements regarding the Company’s predicted overall performance are forward-on the lookout and hence involve threats and uncertainties, together with but not constrained to: a probable world-extensive recession or depression resulting from the financial implications of the COVID-19 pandemic the negative influence on our income and operating benefits of the COVID-19 crisis on our consumers and suppliers and the world source chain sector problems in the international SMT and semiconductor cash gear industries trade relations between the United States and China and other nations around the world the timing of orders and shipments of our merchandise, particularly our 3D MRS™ SQ3000 Multi-Purpose systems™ and MX techniques for memory module inspection rising value competition and selling price tension on our solution income, specifically our SMT devices the amount of orders from our OEM shoppers the availability of sections required to meet customer orders unanticipated product growth issues the result of globe situations on our sales, the vast majority of which are from international clients immediate changes in engineering in the electronics and semiconductor marketplaces solution introductions and pricing by our competition the good results of our 3D know-how initiatives the market acceptance of our SQ3000 MultiFunction™ inspection and measurement devices and items for semiconductor innovative packaging inspection and metrology high-priced and time consuming litigation with 3rd events relevant to intellectual residence infringement the unfavorable effects on our shoppers and suppliers thanks to previous and future terrorist threats and attacks and any functions of war the influence of the MX3000™ orders on our consolidated gross margin percentage in any foreseeable future time period pitfalls connected to cancellation or renegotiation of orders we have been given and other aspects established forth in the Company’s filings with the Securities and Trade Commission.
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Call: For extra information, get in touch with:Carla Furanna
Vice President of World wide Marketing, CyberOptics
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PUB: 01/29/2021 09:00 AM/DISC: 01/29/2021 09:01 AM