April 17, 2021


Advances in world technology

Insights on the Semiconductor Packaging World Marketplace to 2027 – Showcasing Amkor Technological innovation, ASE Group and Chipbond Engineering Amid Others

Dublin, Jan. 15, 2021 (Globe NEWSWIRE) — The “Semiconductor Packaging – World Marketplace Trajectory & Analytics” report has been additional to ResearchAndMarkets.com’s giving.

The publisher provides many years of study encounter to the 7th version of this report. The 290-web site report provides concise insights into how the pandemic has impacted generation and the invest in aspect for 2020 and 2021. A small-term phased restoration by key geography is also tackled.

World wide Semiconductor Packaging Market to Arrive at $41.8 Billion by 2027

Amid the COVID-19 crisis, the world-wide market for Semiconductor Packaging approximated at US$26.7 Billion in the calendar year 2020, is projected to reach a revised dimensions of US$41.8 Billion by 2027, developing at a CAGR of 6.6% in excess of the investigation time period 2020-2027.

Natural substrates, one particular of the segments analyzed in the report, is projected to history a 7.4% CAGR and attain US$22.3 Billion by the finish of the analysis interval. Right after an early investigation of the business implications of the pandemic and its induced economic crisis, advancement in the Lead frames segment is readjusted to a revised 6.3% CAGR for the following 7-yr period of time.

The U.S. Marketplace is Estimated at $7.2 Billion, Even though China is Forecast to Increase at 10.2% CAGR

The Semiconductor Packaging marketplace in the U.S. is approximated at US$7.2 Billion in the calendar year 2020. China, the world`s 2nd major economic system, is forecast to reach a projected market sizing of US$9.1 Billion by the 12 months 2027 trailing a CAGR of 10.2% over the investigation time period 2020 to 2027. Amongst the other noteworthy geographic markets are Japan and Canada, just about every forecast to increase at 3.5% and 6% respectively about the 2020-2027 period of time. In just Europe, Germany is forecast to grow at somewhere around 4.2% CAGR.

Bonding wires Section to History 5.8% CAGR

In the world Bonding wires phase, United states, Canada, Japan, China and Europe will travel the 5.3% CAGR believed for this segment. These regional marketplaces accounting for a merged market place dimension of US$3 Billion in the year 2020 will attain a projected sizing of US$4.3 Billion by the close of the assessment interval. China will remain among the the speediest expanding in this cluster of regional markets. Led by nations around the world this sort of as Australia, India, and South Korea, the current market in Asia-Pacific is forecast to achieve US$5.7 Billion by the calendar year 2027, while Latin America will extend at a 7% CAGR by way of the examination period of time.

Rivals determined in this sector contain, between others:

  • Amkor Technological innovation, Inc.
  • ASE Team
  • Chipbond Technologies Company
  • ChipMOS Systems, Inc.
  • Fujitsu Ltd.
  • Intel Company
  • Interconnect Programs, Inc.
  • Powertech Technological innovation, Inc.
  • Samsung Electronics Co., Ltd.
  • Siliconware Precision Industries Co., Ltd. (SPIL)
  • STATS ChipPAC Pte. Ltd.
  • Tianshui Huatian Technological know-how Co., Ltd.
  • Unisem (M) Berhad
  • UTAC Holdings Ltd.

Important Subject areas Included:



1. Market place OVERVIEW

  • World wide Competitor Sector Shares
  • Semiconductor Packaging Competitor Industry Share Circumstance All over the world (in %): 2019 & 2025
  • Effect of Covid-19 and a Looming World wide Economic downturn

2. Focus ON Choose Gamers

3. Current market Developments & Motorists

4. Worldwide Marketplace Perspective

III. Market place Evaluation

IV. Level of competition

  • Total Businesses Profiled: 41

For much more facts about this report check out https://www.researchandmarkets.com/r/ka847x

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